| 发明名称 |
Laminated body and semiconductor device |
| 摘要 |
A laminate includes a copper wiring layer (20) provided over a semiconductor layer and having a specific pattern, a protective layer (30) formed of a polybenzoxazole resin layer provided on the copper wiring layer (20), and an insulating layer (40) provided on the protective layer.
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| 申请公布号 |
US7608928(B2) |
申请公布日期 |
2009.10.27 |
| 申请号 |
US20050597172 |
申请日期 |
2005.05.20 |
| 申请人 |
JSR CORPORATION;SUMITOMO BAKELITE CO., LTD. |
发明人 |
SHIRATO KAORI;SHIOTA ATSUSHI;TADA MASAHIRO;ASAKUMA SUMITOSHI |
| 分类号 |
H01L23/48;C08G73/22;C08L79/04;H01L21/312;H01L21/768;H01L23/52 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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