发明名称 Component arrangement provided with a carrier substrate
摘要 A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which is mounted on at least one side of the glass film. The component is covered and sealed by a cover layer mounted on the carrier substrate.
申请公布号 US7608789(B2) 申请公布日期 2009.10.27
申请号 US20050573610 申请日期 2005.08.02
申请人 EPCOS AG 发明人 KRUEGER HANS;STELZL ALOIS
分类号 H01L23/28 主分类号 H01L23/28
代理机构 代理人
主权项
地址