发明名称 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
摘要 |
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.
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申请公布号 |
US7608924(B2) |
申请公布日期 |
2009.10.27 |
申请号 |
US20070800003 |
申请日期 |
2007.05.03 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
MYERS BRUCE A.;RATELL JOSEPH M. |
分类号 |
H01L23/473 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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