发明名称 Circuit board mounting for temperature stress reduction
摘要 A circuit board mounting system in one example comprises an improved mounting system for a circuit board disposed between housing elements, wherein the improvement comprises a plurality of slots formed in the circuit board and a plurality of bushings disposed within the slots, such that the housing elements rest on opposed ends of the bushings, and the circuit board moves in a plane substantially parallel to its mounting surfaces in response to changes in temperature, thus reducing thermal stress.
申请公布号 US7607350(B2) 申请公布日期 2009.10.27
申请号 US20050244464 申请日期 2005.10.06
申请人 NORTHROP GRUMMAN GUIDANCE AND ELECTRONICS COMPANY, INC. 发明人 CHOI YOUNGMIN A.
分类号 G01P9/04;G01C19/56;G01P1/02 主分类号 G01P9/04
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