发明名称 Substrate processing apparatus and method
摘要 In a substrate processing apparatus that supports substrates W by a plurality of holding members of a rotor to process the substrates W rotated by the rotor, any one of the holding members is provided with press devices 130 to apply pressures on the peripheries of the substrates W. Each press device 130 has an abutting part 160 for contact with the periphery of the substrate W, a cylinder mechanism 161 for moving the abutting part 160 between a position in contact with the periphery of the substrate W and another position apart from the periphery of the substrate W and a deformable part 162 elastically deformed by the movement of the abutting part 160 to isolate the cylinder mechanism 161 from an atmosphere around the substrates W. Consequently, it is possible to provide the substrate processing apparatus and method that do not cause a diaphragm to be deformed excessively.
申请公布号 US7608163(B2) 申请公布日期 2009.10.27
申请号 US20030454130 申请日期 2003.06.03
申请人 TOKYO ELECTRON LIMITED 发明人 TAIRA MASAKI
分类号 B08B11/02;H01L21/304;B08B3/02;H01L21/00 主分类号 B08B11/02
代理机构 代理人
主权项
地址