| 摘要 |
In adhesive composition for production of plywood and veneer products adhesion temperature is decreased to 100 °С instead of conventional one of 110-130 °С due to that it additionally contains hydrogen peroxide and composite curative. This enables the production of plywood and veneer products without adhesion defects (such as lamination), pressing value and power consumption for gluing process are decreased. The adhesive composition contains phenol-formaldehyde resin (100 parts by weight), resorcin (2-3 parts by weight), paraformaldehyde (5 parts by weight), and additionally it contains hydrogen peroxide (1 part by weight) and composite curative (5-7 parts by weight) containing carbamide – 3 parts by weight, sodium bichromate – 3 parts by weight and water – 3 parts by weight. |
