Printed circuit board for electronic module, has relief delimiting zone-to-be-protected from zone-to-be-varnished, where relief creates obstacle to flow of protective varnish from zone-to-be-varnished to zone-to-be-protected

摘要

#CMT# #/CMT# The board (8) has a zone-to-be-protected (6) and a zone-to-be-varnished (5) that is covered with a protective varnish (16). A separation relief (7) is provided between the zones, where the relief is made of a metallic strip (3) covered by an over thickness of a soldering metal (4). The relief delimits the zone (6) from the zone (5), where the relief creates an obstacle to a flow of protective varnish from the zone (5) to the zone (6). The relief is made of two dedicated parallel metallic strips (3') respectively covered with the over thickness of the soldering metal. #CMT# : #/CMT# An independent claim is also included for a method for obtaining a printed circuit board. #CMT#USE : #/CMT# Printed circuit board for an electronic module (claimed). #CMT#ADVANTAGE : #/CMT# The relief creates the obstacle to the flow of protective varnish from the zone-to-be-varnished to the zone-to-be-protected, so that the relief permits increasing the quantity of the protective varnish for covering the zone-to-be-varnished without the risk of overflowing of the protective varnish towards the zone-to-be-protected, thus protecting the board, while avoiding contamination of other zones. The relief permits reducing the distance at which the spray nozzle is placed with respect to the zone-to-be-varnished. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic sectional view of a printed circuit board along a line. 3 : Metallic strip 3' : Dedicated parallel metallic strips 4 : Soldering metal 5 : Zone-to-be-varnished 6 : Zone-to-be-protected 7 : Separation relief 8 : Printed circuit board 16 : Protective varnish.