发明名称 MOLDING MOLD
摘要 <P>PROBLEM TO BE SOLVED: To provide a molding mold capable of simultaneously ensuring both transfer characteristics and mechanical characteristics without causing deterioration in durability of a molding mold even when a molding cycle of a molding body is shortened. Ž<P>SOLUTION: The molding mold is equipped with a first mold having a first molding surface having a stamper to be mounted and a second mold having a second molding surface opposed to the first molding surface. The first mold has a buffer part which buffers the temperature change of a molten resin when the molten resin is supplied into a molding space between the first molding surface and the second molding surface. A thermal buffer part is provided in the vicinity of the first molding surface without exposing from the first molding surface. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009241273(A) 申请公布日期 2009.10.22
申请号 JP20080087733 申请日期 2008.03.28
申请人 SONY CORP 发明人 GOKO TAKESHI
分类号 B29C33/02;B29C33/38 主分类号 B29C33/02
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