发明名称 |
METHOD FOR PROCESSING DIE FOR OPTICAL ELEMENT, MOLDING DIE, AND OPTICAL ELEMENT |
摘要 |
<p>Provided is a method for machining a die, wherein rotation of a tool is not required, a processing machine which performs linear two-axis operation is used, and both side surfaces of a solid structure of a molding surface of the die can be easily and symmetrically processed without interference of the tool. A processing position is reversed without rotating the direction of a blade edge (23a) of a cutting tool (23), which greatly influences process accuracy. Thus, while eliminating interference between the cutting tool (23) and a work (W), both side surfaces (SS1, SS2) of a solid structure (SA2) can be symmetrically processed by sandwiching an axis parallel to the center axis (RA) of the work (W).</p> |
申请公布号 |
WO2009128313(A1) |
申请公布日期 |
2009.10.22 |
申请号 |
WO2009JP55048 |
申请日期 |
2009.03.16 |
申请人 |
KONICA MINOLTA OPTO, INC.;MATSUDA, HIROYUKI;HOSOE, SHIGERU |
发明人 |
MATSUDA, HIROYUKI;HOSOE, SHIGERU |
分类号 |
B23B5/36;B29C33/38;B29L11/00;G02B3/00 |
主分类号 |
B23B5/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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