发明名称 METHOD FOR PROCESSING DIE FOR OPTICAL ELEMENT, MOLDING DIE, AND OPTICAL ELEMENT
摘要 <p>Provided is a method for machining a die, wherein rotation of a tool is not required, a processing machine which performs linear two-axis operation is used, and both side surfaces of a solid structure of a molding surface of the die can be easily and symmetrically processed without interference of the tool. A processing position is reversed without rotating the direction of a blade edge (23a) of a cutting tool (23), which greatly influences process accuracy. Thus, while eliminating interference between the cutting tool (23) and a work (W), both side surfaces (SS1, SS2) of a solid structure (SA2) can be symmetrically processed by sandwiching an axis parallel to the center axis (RA) of the work (W).</p>
申请公布号 WO2009128313(A1) 申请公布日期 2009.10.22
申请号 WO2009JP55048 申请日期 2009.03.16
申请人 KONICA MINOLTA OPTO, INC.;MATSUDA, HIROYUKI;HOSOE, SHIGERU 发明人 MATSUDA, HIROYUKI;HOSOE, SHIGERU
分类号 B23B5/36;B29C33/38;B29L11/00;G02B3/00 主分类号 B23B5/36
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