| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition nearly free from a fall of a resist pattern and deterioration of a profile thereof not only in usual exposure (dry exposure) but also in immersion exposure, and to provide a pattern forming method using the positive photosensitive resin composition. <P>SOLUTION: The positive photosensitive resin composition contains (A) a resin which includes an acid decomposition recurring unit represented by general formula (Ia) and/or (Ib) and whose dissolution rate in an alkali developer is increased by an action of acid and (B) a compound generating acid by irradiation with an active ray or a radiation. In general formula (Ia) and (Ib), Xa<SB>1</SB>denotes a hydrogen atom, an alkyl group, a hydroxymethyl group, a trifluoromethyl group, a cyano group or a halogen atom, Ry<SB>1</SB>denotes an alkyl group or a cycloalkyl group, Ra denotes an alkyl group or a cycloalkyl group, l denotes an integer of 2 to 3, m denotes an integer of 1 to 8 and n denotes an integer of 4 to 8. When a plurality of Ra are arranged, they may be equal to or different from each other and may be bonded to form a ring. <P>COPYRIGHT: (C)2010,JPO&INPIT |
