| 摘要 |
PROBLEM TO BE SOLVED: To prevent a component mounting surface for component mounting portions from being scratched or stained or from having resin burrs without bringing a metal mold into contact with the component mounting surface when exposing the component mounting surface from a mold resin in a pre-mold structure, and further to suppress extension of interface peeling between a sealing material and the mold resin to the component mounting surface when sealing the component mounting surface with the sealing material. SOLUTION: A tape 200 covering an area of a plurality of component mounting portions 31 and 32 is stuck on one-side plate surfaces as component mounting surfaces of the component mounting portions 31 and 32, and then enters into between the component mounting portions halfway along the plate thicknesses of the component mounting portions 31 and 32, the mold resin 40 is provided on the other-side plate surfaces of the component mounting portions 31 and 32, and then the tape 200 is peeled off a lead frame 30. Then electronic components 10 and 20 are mounted on the one-side plate surfaces of the component mounting portions 31 and 32. COPYRIGHT: (C)2010,JPO&INPIT |
