发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste which excels in adhesion and printability, hardly causes failures such as sheet attack or delamination, excels in surface smoothness after application and drying and reduces residual carbon after calcination. SOLUTION: The conductive paste contains (meta)acryl resin, organic solvent and conductive powder. In this case, the (meta)acryl resin has a weight average molecular weight of 5,000 to 50,000 and the organic solvent is propylene carbonate orγ-butyrolactone. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009245648(A) 申请公布日期 2009.10.22
申请号 JP20080088230 申请日期 2008.03.28
申请人 SEKISUI CHEM CO LTD 发明人 YAMAUCHI KENJI;TAKAHASHI HIDEYUKI
分类号 H01B1/22;H01G4/12;H01G4/30 主分类号 H01B1/22
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