| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a solder bump with high versatility that forms a solder bump with high accuracy and a high aspect ratio even at narrow pitch and can prevent the conduction (bridge) with adjacent solders. Ž<P>SOLUTION: The method of forming a solder bump includes: a first discharging step of discharging a solder paste 101 to an electrode 21 from a height h1 in vertical direction from the electrode 21 wherein the solder bump is formed; a second discharging step of discharging a solder paste 102 to the electrode 21 from a height h2 in vertical direction from the electrode 21 after the first discharging step; a step wherein a solder paste 100 supplied onto the electrode 21 is formed substantially conical; and a step of melting the solder paste 100 by heating to form a solder bump. In this case, the relationship between h1 and h2 is h1<h2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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