发明名称 |
Polishing method and polishing apparatus, and program for controlling polishing apparatus |
摘要 |
A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer or the like, before resuming polishing, thereby eliminating the cost of dummy wafer or the like. The polishing method comprises: carrying out a stand-by operation during a polishing-resting time period; carrying out a preparatory process to polishing, after completion of the stand-by operation, by dressing a polishing surface while supplying a polishing liquid to the polishing surface; and starting polishing of a workpiece after completion of the preparatory process to polishing. Determination as to whether to carry out the preparatory process to polishing after completion of the stand-by operation may be made based on the total operating time of the stand-by operation or the total effective number of the stand-by operations.
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申请公布号 |
US2009264052(A1) |
申请公布日期 |
2009.10.22 |
申请号 |
US20060991064 |
申请日期 |
2006.09.12 |
申请人 |
TORIKOSHI TSUNEO;YAMAGUCHI KUNIAKI |
发明人 |
TORIKOSHI TSUNEO;YAMAGUCHI KUNIAKI |
分类号 |
B24B1/00;B24B37/00;B24B53/00;B24B53/013;B24B53/017;B24B53/02;H01L21/304 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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