| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing which retains void generation suppressing property and moisture resistance requested as a resin for semiconductor chip sealing, can keep fillet height down even in the case of a thin chip so that contact of a heating tool with the resin is avoided, and is used in a mounting process by a pressure welding technique of a semiconductor chip with uniform fillet shape and excellent sealing property. <P>SOLUTION: The epoxy resin composition for semiconductor sealing in resin pre-setting type flip-chip mounting comprises an epoxy resin (A), a solid phenol novolac resin or naphthol novolac resin (B) in such a ratio to the resin (A) that the number of moles of phenolic hydroxy groups becomes 0.01-0.3 time the number of moles of epoxy groups in the resin (A), and a trialkyltetrahydrophthalic anhydride (C) in such a ratio to the resin (A) that double of the number of moles of acid anhydride groups becomes 0.6-1.2 times the number of moles of epoxy groups in the resin (A). <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
