| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus capable of enhancing electrical connection reliability between a solid-state imaging element and a wiring board. Ž<P>SOLUTION: In this solid-state imaging apparatus 100, electrode terminals 12 are formed to cover openings on a front surface which are formed by through-holes 11, and projecting electrodes 22 corresponding to the electrode terminals 12 are formed on a light reception surface of a solid-state imaging element 2. The projecting electrodes 22 are inserted in the through-holes 11 from the back side of a wiring board 1, and contact the electrode terminals 12. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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