| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the characteristics of a Corson alloy by controlling the distributing state of Ni-Si compound grains. <P>SOLUTION: In a copper alloy for electronic material consisting with 0.4-6.0 mass% Ni, 0.1-2.0 mass% Si and the balance Cu with inevitable impurities, the copper alloy has Ni-Si compound small grains having 0.01-0.05μm grain diameter and Ni-Si compound large grain having 0.05μm to <5.0μm grain diameter, and the small granular piece density is 10<SP>6</SP>-10<SP>10</SP>pieces/mm<SP>2</SP>and the large granular piece density is 1/10000-1/10 in comparison with the small granular piece density, as the copper alloy for electronic material. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
