| 摘要 |
PROBLEM TO BE SOLVED: To provide a double coated adhesive tape which includes high heat resistance and is easily peeled off by irradiation with light without damaging an adherend. SOLUTION: Disclosed is the double coated adhesive tape for semiconductor processing which includes an adhesive layer formed on both surfaces of a base, which includes nitrogen gas transparency of≥100×10<SP>-17</SP>mol m<SP>-1</SP>s<SP>-1</SP>Pa<SP>-1</SP>at 23°C. One adhesive layer contains an azide compound and does not contain a compound having reactive double bonds, and the other adhesive layer is made of an adhesive which hardens by stimulation. COPYRIGHT: (C)2010,JPO&INPIT |
