| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which enhances adhesion strength of a via conductor and improves the product yield. SOLUTION: A coreless wiring board 10 does not have a core substrate but includes a multilayer structure 20 obtained by laminating a conductor layer 26 and resin insulating layers 21-24 alternately. Each resin insulating layer 21-24 is formed to contain a glass cloth 36 in epoxy resin. A plurality of frustoconical via holes 32 having a level difference in the inner wall face are made through each resin insulating layer 21-24, and a field via conductor 33 which connects the conductor layers 26 electrically is formed in each via hole 32. COPYRIGHT: (C)2010,JPO&INPIT |
