| 摘要 |
PROBLEM TO BE SOLVED: To provide an Au-Sn alloy solder paste for dispensed coating. SOLUTION: The Au-Sn alloy solder paste consists of Au-Sn alloy solder powder having the component composition containing 15-25 mass% Sn, and the balance Au with inevitable impurities, and has the grain size distribution in which the mean grain size is≤5μm, and the maximum grain size is≤10μm, and RA flux. The viscosity of the Au-Sn alloy solder paste is in a range of >50 to 120 Pa s. COPYRIGHT: (C)2010,JPO&INPIT |
