| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can be used as an electric conductive paste, especially a thermosetting soldering paste for mounting a part onto a wiring board, etc., which has high storage stability at room temperature, with which a plurality of parts can be mounted in batch by a soldering reflow process when the parts are mounted on the wiring board, etc. and high strength and toughness can be given to a soldering connection part. Ž<P>SOLUTION: This invention is related to a thermosetting resin composition. This thermosetting resin composition contains soldering particles with the fusing point of 240°C or lower, a thermosetting resin binder, a flux component containing a dicarboxylic acid, and a preservation stabilizer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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