发明名称 TITANIUM COPPER FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide titanium copper in which the roughening of a bent part can be suppressed without refining crystal grains over the whole of the material. SOLUTION: A copper alloy is disclosed for an electronic component having a composition comprising, by mass, 2 to 4% Ti, and comprising one or more selected from the group consisting of Mn, Fe, Co, Ni, Cr, V, Nb, Mo, Zr, Si, B and P as the third element group by 0.05 to 0.5% in total, and the balance copper with inevitable impurities, and in the average major axis (a) of the crystals in the rolling face of the copper alloy, the relation of 1<a/b is valid with the average major axis (b) of the crystals at the inside of≥10μm from the rolling face. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009242881(A) 申请公布日期 2009.10.22
申请号 JP20080091704 申请日期 2008.03.31
申请人 NIPPON MINING & METALS CO LTD 发明人 SUGAWARA YASUTAKA
分类号 C22C9/00;C22F1/00;C22F1/08 主分类号 C22C9/00
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