发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device for suppressing the breakdown voltage degradation of a gate oxide film. SOLUTION: The manufacturing method of the semiconductor device includes: a first process of preparing a semiconductor substrate 10 for which an epitaxial layer 12 is formed on the front surface and a first insulating film 14 is formed on the back surface; a second process of forming an oxide film 16 on the surface on the opposite side of the semiconductor substrate 10 of the epitaxial layer 12; a third process of forming a second insulating film 18 on the surface on the opposite side of the semiconductor substrate 10 of the first insulating film 14; and a fourth process of removing the oxide film 16. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009245968(A) 申请公布日期 2009.10.22
申请号 JP20080087398 申请日期 2008.03.28
申请人 OKI SEMICONDUCTOR CO LTD;OKI SEMICONDUCTOR MIYAZAKI CO LTD 发明人 KANEKO YUICHI
分类号 H01L21/322;H01L21/336;H01L21/8234;H01L27/088;H01L29/78 主分类号 H01L21/322
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