发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device for suppressing the breakdown voltage degradation of a gate oxide film. SOLUTION: The manufacturing method of the semiconductor device includes: a first process of preparing a semiconductor substrate 10 for which an epitaxial layer 12 is formed on the front surface and a first insulating film 14 is formed on the back surface; a second process of forming an oxide film 16 on the surface on the opposite side of the semiconductor substrate 10 of the epitaxial layer 12; a third process of forming a second insulating film 18 on the surface on the opposite side of the semiconductor substrate 10 of the first insulating film 14; and a fourth process of removing the oxide film 16. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009245968(A) |
申请公布日期 |
2009.10.22 |
申请号 |
JP20080087398 |
申请日期 |
2008.03.28 |
申请人 |
OKI SEMICONDUCTOR CO LTD;OKI SEMICONDUCTOR MIYAZAKI CO LTD |
发明人 |
KANEKO YUICHI |
分类号 |
H01L21/322;H01L21/336;H01L21/8234;H01L27/088;H01L29/78 |
主分类号 |
H01L21/322 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|