| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive conductive paste composition that can form a circuit pattern achieving high-definition patterning, having stable adhesiveness to a substrate or a lower layer in each process of drying, exposure, development and baking, having excellent baking property, excelling in adhesiveness to the substrate and adhesiveness between layers after baking, suppressing the formation of edge curls and showing a low sheet resistance value. Ž<P>SOLUTION: The photosensitive conductive paste composition contains (A) a photosensitive organic component, (B) conductive powder, (C) a solvent and (D) resin particles insoluble in the solvent. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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