发明名称 |
Chip mounting device and chip package array |
摘要 |
A chip mounting device includes at least one chip mounting unit and at least one side rail configured beside the chip mounting unit. The chip mounting unit includes a die pad and a plurality of conductive contacts. The side rail includes at least one identifying element. A chip package array with the above-mentioned chip mounting device is also disclosed. The chip mounting device and chip package array includes the identifying element configured on the side rail to improve the identification of semi-finished packaged chips during chip package process to be read automatically by machines instead of operators, and further decrease the loss caused by misjudgments of operators.
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申请公布号 |
US2009261463(A1) |
申请公布日期 |
2009.10.22 |
申请号 |
US20080155350 |
申请日期 |
2008.06.03 |
申请人 |
CHEN CHIN-TI;WANG CHIN-FA |
发明人 |
CHEN CHIN-TI;WANG CHIN-FA |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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