发明名称 ELECTRONIC COMPONENT AND METHOD OF FORMING COATING FILM ON ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic component coated with a coating film having high mechanical strength and a method of forming a coating film on an electronic component. <P>SOLUTION: A powdered coating material made of a filler and a silicone resin component containing glass fibers, an additive, and an inevitable impurity, is prepared as the material of a coating film on a varistor element 45, and is floated in a bath 40. The varistor element 45 is then put in the bath 40 to coat the surface of the varistor element 45 with the coating material up to a given film thickness. The coating material film is then heated to melt the resin component, and is cured. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009246114(A) 申请公布日期 2009.10.22
申请号 JP20080090463 申请日期 2008.03.31
申请人 KOA CORP 发明人 ISHIDA MAYU;MIYATA SHUNICHI
分类号 H01C1/02;H01C7/10 主分类号 H01C1/02
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