| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a cured pattern or a cured film excellent in sensitivity, resolution and heat resistance, to provide a method for manufacturing a pattern for obtaining the pattern which is excellent in sensitivity, resolution and heat resistance and has a satisfactory shape by using the photosensitive resin composition, and to provide an electronic device having high reliability by forming the pattern having a satisfactory shape and characteristic. <P>SOLUTION: The photosensitive resin composition includes a polymer compound (a) and a light sensitive material (b) obtained by reacting a monomer represented by the general formula (1) with a monomer represented by the general formula (2). Therein, T denotes oxygen atom and/or sulfur atom. Ar<SB>1</SB>and Ar<SB>2</SB>respectively denote 6-30C bivalent to hexavalent organic groups and are preferably substituted with substituent. R<SB>1</SB>and R<SB>2</SB>denote hydrogen atom or silyl group and preferably are different from each other or equal to each other. X<SB>1</SB>and X<SB>2</SB>denote leaving groups and may be different from each other or equal to each other. Y presents a group containing an acidic group or an acidic group protected by acid-degradable group. A plurality of groups Y contained in the polymer compound may be one or two or more kinds. Therein, a and b respectively denote an integer of 0 to 4 and satisfy the relation: a+b≥1. <P>COPYRIGHT: (C)2010,JPO&INPIT |
