| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that offers a wide range of the selection of resin and excellent adhesion between a substrate and the resin. <P>SOLUTION: A semiconductor device has a first region 40 and a second region 50 disposed adjacent to the outside of the first region 40, and comprises: a semiconductor substrate having a main surface and side surfaces and disposed in such a manner that the main surface is positioned in the first region 40 and each of the side surfaces is positioned at a boundary between the first region 40 and the second region 50; a plurality of pads 18 and a plurality of external connection terminals electrically connected to the plurality of pads 18 which are formed on the main surface of the semiconductor substrate; a first resin portion 34 which is formed over the main surface of the semiconductor substrate so as to cover the plurality of pads 18, has a main surface and side surfaces, and is formed in such a manner that the external connection terminals are exposed from the main surface, and each of the side surfaces 42 is positioned at the boundary; and a second resin portion 46 which is positioned in the second region 50 is formed so as to cover the side surfaces of the semiconductor substrate and the side surfaces 44 of the first resin portion 34, and different in composition from the first resin portion 34. <P>COPYRIGHT: (C)2010,JPO&INPIT |
