| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means for enhancing the reliability of connections between a semiconductor element and a wiring substrate by avoiding poor electrical connections between an electrode of the semiconductor element and an electrode of the wiring substrate and shortage between the adjacent electrodes, in flip chip implementation. <P>SOLUTION: A circuit substrate includes: a wiring substrate 13 which includes a first electrode 14; a semiconductor device 17 which includes a second electrode 16 in a surface thereof and is arranged on the wiring substrate so that the second electrode is opposed to the first electrode; and a conductive adhesive which is arranged between the wiring substrate and the semiconductor element. The conductive adhesive consists of: a first insulating resin 12; and conductive particles 11 which are dispersed within the first insulating resin and cover a surface of a core particle 1 with a conductive film 2 and a second insulating resin 3, in sequence. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
