| 摘要 |
The invention relates to a chip card in the form of an ID-1 card, a plug-in SIMs, or a USB token, comprising a layered composite (12) having two (4, 5) or three (4, 5, 9) layers extending across the entire chip card (1). For this purpose an exterior film layer (4) has a communication contact layout (2) on the front (4a) thereof facing toward the exterior (4b), and a flip chip (7) on the back thereof, and a flip chip contact layout (6) being connected to the front communication contact layout (2) in an electrically conducting manner. |
