| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition suiting application in a surface protective layer, an interlayer insulation film, and an insulation film for a high density packaging board capable of very thick application and alkali development, and capable of providing a hard object with high resolution, superior tensile elongation after fracture, and superior heat resistance. <P>SOLUTION: The radiation sensitive resin composition includes: (A) a polyimide polymer having hydroxyl group containing repeating units of two particular structures; (B) at least one type of a compound selected from an oxirane group containing compound or an oxetanyl group containing compound; (C) a compound having an alkoxyalkylated amino group; (D) a photoacid generator; and (E) a solvent. <P>COPYRIGHT: (C)2010,JPO&INPIT |
