| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting apparatus which enhancex miniaturization and packaging accuracy. <P>SOLUTION: The semiconductor light-emitting apparatus A includes an LED chip 2, leads 1A, 1B, and a resin package 4 having a lens 4a. The lead 1A includes a pad 11A on which the LED chip 2 is mounted, a pair of standing portions 12A projected from the resin package 4 contrariwise to the light outgoing direction in a direction x as an optical axis L direction of the lens 4a and mutually estranged with the pad 11A in between in a direction y crossing to the direction x, and a pair of terminals 13A extending contrariwise in the direction y from the standing portions 12A. <P>COPYRIGHT: (C)2010,JPO&INPIT |
