发明名称 INTERLAMINAR MATERIAL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a reusable interlaminar material which is used to be positioned between continuous sheets with electronic parts mounted thereon, in winding the sheets for preventing the parts from being broken by winding force in winding the sheets and for preventing IC chips from being damaged by static electricity. <P>SOLUTION: This interlaminar material 10 is interposed between continuous sheets with electronic parts mounted thereon, when the sheet is wound. The material is provided with a mesh cloth 13 which contacts the sheets in winding, with the sheets, and whose sieve opening is large enough to store at least one electronic part. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009241932(A) 申请公布日期 2009.10.22
申请号 JP20080088002 申请日期 2008.03.28
申请人 TOPPAN FORMS CO LTD 发明人 SAKURAI TAKAHIRO
分类号 B65D85/86;B65D73/02;B65H18/00;H01L23/00 主分类号 B65D85/86
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