SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device including a dummy via, wherein problems such as lowering in the easiness of design and increase in fabrication cost which result from the existence of a dummy wire connected to the dummy via are suppressed. SOLUTION: The semiconductor integrated circuit device includes a substrate 1 and three or more wiring layers 2a to 2c formed on the substrate 1. The dummy via 11 connects between the wiring layers 2a and 2b. The dummy wire 12 connected to the dummy via 11 exists in the second wiring layer 2b. A protrusion amount of the dummy wire 12 is smaller than a protrusion amount of an intermediate wire 24 formed in the wiring layer 2b of a stacked via structure 20. COPYRIGHT: (C)2010,JPO&INPIT