| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method of an integrated circuit chip on a board hardly causing a failure such as disconnection in wiring of the integrated circuit chip, and can improve reliability; and to provide a mounting device of an integrated circuit chip used for its manufacture. Ž<P>SOLUTION: When embedding an integrated circuit chip 10 in a board having a plastic resin layer on a surface, the mounting method executes: a first step of filling a clearance pocket 23 formed on a side surface of the integrated circuit chip 10 in the resin layer with droplets 26 of an insulating resin discharged by using a predetermined nozzle; and a second step of forming, from a chip electrode 10a to a board electrode 25, a wiring layer 28 containing a conductive material by straddling the clearance pocket 23 filled with the insulating resin. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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