| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an imaging device package capable of facilitating a process for preventing dust, or the like, from infiltrating a portion between the imaging device and a glass substrate. Ž<P>SOLUTION: The method includes: a process for applying a thermoplastic adhesive 8 onto the glass substrate 2 so that a light-receiving surface 3 of the imaging device 1 can be surrounded; a process for coating a prescribed part of an electrode pattern 5 with a conductive paste 6; a process for placing the imaging device 1 on the glass substrate 2 so that the light-receiving surface 3 of the imaging device 1 can be fitted into a frame and a terminal 4 of the imaging device 1 corresponds to the electrode pattern 5; a process for placing an external connection terminal 4; and a process for heating the thermoplastic adhesive 8 with the conductive paste 6 for electrically connecting among the electrode pattern 5, the imaging device 1, and the external connection terminal 7. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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