| 摘要 |
The invention discloses an electronic storage device package. The electronic storage device package according to the invention includes a substrate, a plurality of passive electronic components, a controller die, a memory die, a connector and a casing. The electronic components, the controller die and the memory die are attached on an upper surface of the substrate and electrically connected to a connecting circuit formed on the upper surface. In addition, the electronic components, the controller die and the memory die are encapsulated by an insulating material. Terminals of the connector are attached to contacts formed on a lower surface of the substrate. In particular, the substrate and the connector are fixed in the casing by performing an ultrasonic welding treatment on the casing.
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