发明名称 INSULATION SHEET AND MULTILAYER BOARD
摘要 PROBLEM TO BE SOLVED: To provide an insulation sheet having excellent handling properties in its uncured state, and giving a cured material excellent in dielectric properties, dielectric breakdown properties, adhesion, and heat resistance. SOLUTION: The insulation sheet comprises (A) a polymer having a≥30,000 weight-average molecular weight, (B1) an epoxy monomer and/or (B2) an oxethane monomer having an aromatic skeleton and having a≤600 weight-average molecular weight, (C) a curing agent of being an acid anhydride having an aromatic skeleton or aliphatic skeleton, its hydrogenated product or its modified material, (D) a curing promoter, and (E) a filler containing (E1) a filler having a dielectric constant of≥100 and having an average particle diameter of 0.01-0.5μm and (E2) a filler having a dielectric constant of≥100 and having an average particle diameter of 0.8-3μm in specific proportions. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009242670(A) 申请公布日期 2009.10.22
申请号 JP20080092559 申请日期 2008.03.31
申请人 SEKISUI CHEM CO LTD 发明人 MAENAKA HIROSHI;AOYAMA TAKUJI;KUSAKA YASUNARI;WATANABE TAKASHI
分类号 C08L101/00;C08G59/42;C08K3/00;C08L63/00;C08L71/00;H05K1/03;H05K3/46 主分类号 C08L101/00
代理机构 代理人
主权项
地址