PRODUCING METHOD OF MULTI-LAYER CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a producing method of multi-layer circuit board for improving close contact strength between wiring and insulating resin film while preventing a patterning fault accompanied by advancement in microfabrication. SOLUTION: An insulating resin film 4 is formed on a supporting board 1. The supporting board 1 contains a circuit 3 constituted with copper or the like and formed on a resin board material 2 reinforced by glass-fiber. Moreover, as a material of the insulating resin film 4, a thermosetting epoxy resin, for example, is used. Next, a close contact material 5 is formed on the front surface of the insulating resin film 4 and a protecting resin film 6 is formed on the close contact material 5 to protect the insulating resin film 4 and close contact material 5 using a dry film. Next, a via hole 7 is formed on the protecting resin film 6, close contact material 5, and insulating resin film 4 using the carbonic acid gas laser. In this timing, a smear 8 is generated inevitably at the bottom of the via hole 7. Next, the smear 8 is removed with the plasma dry etching process using CF4gas or the like. Next, the protecting resin film 6 is removed and wiring is formed within the via hole 7 and on the close contact material 6. COPYRIGHT: (C)2010,JPO&INPIT