| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating device capable of suppressing the occurrence of a film defect, a plating method and a method of manufacturing an electronic device. Ž<P>SOLUTION: The plating device is provided with a plating vessel 2 having an opening 10 at one end in an axial direction, a holding means 4 provided to the opening 10 side of the plating vessel 2 to hold a workpiece W, an anode electrode 3 provided in the plating vessel 2 to face the holding means 4, a separating body 12 for separating the inside of the plating vessel 2 into a first region 12a in which the plating liquid is stored and the workpiece W is held and a second region 12b coaxially provided around the first region 12a to be capable of storing a liquid, and an ultrasonic vibration means 9 for applying the ultrasonic vibration to the plating liquid in the first region 12a. The plating method and the method of manufacturing the electronic device use the plating device. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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