| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for grinding a wafer for preventing an occurrence of a chip having a low deflective strength and an occurrence of cracks without lowering a grinding efficiency. SOLUTION: The method for grinding the wafer includes: a first grinding step of grinding an upper surface of the wafer by rotating a chuck table 52 holding the wafer 10 and a grinding stone 327 and positioning the stone at the position passing the center of the wafer; a wafer-orientation step of orienting the upper surface of the periphery of the wafer beneath the rotational excursion of the grinding stone while rotating the chuck table and the grinding stone; and a second grinding step of relatively translating the chuck table and the grinding stone for machining after stopping the rotation of the chuck table by orienting the mark N expressing the crystal orientation of the wafer chucked by the chuck table to a predetermined direction and transferring the grinding stone for grinding by the predetermined amount in a direction perpendicular to the holding surface of the chuck table while rotating the grinding stone. COPYRIGHT: (C)2010,JPO&INPIT
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