| 发明名称 |
LIQUID RESIN COMPOSITION, SEMI-CONDUCTOR DEVICE, AND PROCESS OF FABRICATING THE SAME |
| 摘要 |
A liquid resin composition for use as a sealing resin which reduces wear on a dicing blade or grinder employed for signularization or grinding. The liquid resin composition includes hollow and/or porous particles as a filler, and is adapted in use to be applied on a substrate constituting a semi-conductor device or electronic part. |
| 申请公布号 |
US2009261484(A1) |
申请公布日期 |
2009.10.22 |
| 申请号 |
US20090435639 |
申请日期 |
2009.05.05 |
| 申请人 |
|
发明人 |
KANAGAWA NAOKI;MIYATA YASUTAKA |
| 分类号 |
H01L23/29;C08L63/00;C08L63/02;H01L21/56 |
主分类号 |
H01L23/29 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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