PRINTED CIRCUIT BOARD REMOVING BONDING SHEET AROUND SIGNAL TRANSMISSION LINE

摘要

There is provided a printed circuit board (PCB) where bonding sheet parts around a signal transmission line are removed. The PCB includes: a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; a first bonding sheet disposed above the first dielectric layer, separated from the signal transmission line at a predetermined interval on one side thereof, and extended in the same direction of the signal transmission line; a second bonding sheet disposed above the first dielectric layer, separated from the signal transmission line at a predetermined interval on another side thereof, and extended in the same direction of the signal transmission line; a second dielectric layer disposed above the signal transmission line, the first bonding sheet, and the second bonding sheet; and a second ground layer laminated on the second dielectric layer. The first and second bonding sheets bond the first dielectric layer to the second dielectric layer.