| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the number of pins and the size of a semiconductor device. <P>SOLUTION: The semiconductor device includes a sealing body formed of insulating resin and having an upper surface, a lower surface as an opposite surface to the upper surface, and a side surface connecting the upper surface and lower surface, a conductive tab sealed in the sealing body, tab-suspending leads continuing to the tab and of which part is exposed to the lower surface and side surface of the sealing body, a semiconductor chip fixed to a lower surface of the tab, a plurality of conductive leads having protrusion parts of which an inner end part is positioned in the sealing body, and of which an outer end part is exposed to the lower surface and side surface of the sealing body, and which protrudes to an inside of the sealing body from the side surface, protrusion parts protruding from side surfaces of the tab-suspending leads and positioned in the sealing body, and conductive wires positioned in the sealing body and connecting respective electrodes on the lower surface of the semiconductor chip and the respective protrusion parts of the leads and tab-suspending leads. <P>COPYRIGHT: (C)2010,JPO&INPIT |
