| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent an increase in chip size while mounting a circuit for achieving a plurality of functions and coping with the demands of users as much as possible. <P>SOLUTION: The semiconductor device includes: first-fourth inner terminals arranged along the outer periphery on a substrate; the circuit connected to the first inner terminal; a first outer terminal connected to the second inner terminal; a second outer terminal connected to the third inner terminal; and a third outer terminal connected to the fourth inner terminal. The circuit outputs a signal based on the connection state between the first inner terminal and the first outer terminal, the first and second inner terminals are arranged so that a distance between the centers of the first and second inner terminals in a direction parallel to one side of the substrate corresponding to the first outer terminal may be L1, and the third and fourth inner terminals are arranged so that a distance between the centers of the third and fourth inner terminals in a direction parallel to one side of the substrate corresponding to the second and third outer terminals may be L2, and the distance L1 is smaller than the distance L2. <P>COPYRIGHT: (C)2010,JPO&INPIT |
