发明名称 ADHESION METHOD AND POSITIVE-TYPE PHOTOSENSITIVE ADHESIVE COMPOSITION USED THEREFOR, AND ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide technique for forming a resin layer which has superior flowability during heat adhesion and superior adhesive strength, after the pattern formation of a photosensitive thermosetting resin composition used for a permanent film. <P>SOLUTION: A substrate is coated with a positive-type photosensitive adhesive composition, containing (A) alkali-soluble polymer resin having a phenolic hydroxyl group or carboxyl group; (B) a compound having a quinonediazide group; and (C) at least one kind of cross-linking agent, selected from among a group of (c1) a compound having alkyl etherified amino group; (c2) an epoxy resin; and (c3) an oxetane resin; and selective exposure is performed, after prebaking and alkali development has been carried out to form a resist pattern, and after heating or exposure, an adherend is pressed against the resist pattern formation surface of the substrate to bond the substrate and adherend together. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009244663(A) 申请公布日期 2009.10.22
申请号 JP20080092172 申请日期 2008.03.31
申请人 JSR CORP 发明人 ITO JUNJI;GOTO HIROFUMI
分类号 G03F7/40;G03F7/004;G03F7/022 主分类号 G03F7/40
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