| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sputtering method and a sputtering apparatus for achieving the high quality of a film by preventing any reverse sputter by simple constitution and simple control, controlling the deviation of the composition, enhancing reproducibility of the film deposition, and depositing a piezoelectric film of high quality having no change in the film quality, and a thin film such as an insulating film and a conductive film. <P>SOLUTION: The sputtering apparatus has a sputtering electrode for holding a target and a substrate holder which is arranged opposite to the sputtering electrode to hold a substrate in a vacuum vessel, and has an impedance adjusting circuit having an impedance circuit capable of adjusting impedance of the substrate holder. By adjusting the impedance of the impedance circuit, the impedance of the substrate holder is adjusted, and the electric potential of the substrate is adjusted thereby. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
