| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic polymer suitable for sealing a semiconductor having low melting viscosity and flame retardancy, to provide its composition and to provide its production method. SOLUTION: Phenols represented by formula (1), an aromatic compound represented by formula (2) (R<SP>1</SP>denotes hydrogen, a 1-6C alkyl or an aryl and X demotes a halogen, OH or OCH<SB>3</SB>), a m-xylene-formaldehyde condensate and formaldehyde are reacted at a molar ratio of the aromatic compound to the phenols of 0.1 to 0.6, at a rate by weight of the condensate to the phenols of 5 to 25% and at a molar ratio of formaldehyde to the phenols of 0.01 to 0.20 to obtain the phenolic polymer. In the easy and inexpensive production method of the phenolic polymer, the phenols, the aromatic compound and the condensate are reacted and then formaldehyde is added to condense them. As the composition, an epoxy resin composition with an epoxy resin is suitable. COPYRIGHT: (C)2010,JPO&INPIT |
