摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which enhances forward surge breakdown strength while maintaining a high reverse breakdown voltage. SOLUTION: A semiconductor device 1 includes an n<SP>+</SP>-type silicon carbide single crystal substrate 102, an n<SP>-</SP>-type silicon carbide epitaxial layer 104, a polysilicon layer 106, and a back electrode 110, wherein a p-type impurity region 108 is formed on the surface of the n<SP>-</SP>-type silicon carbide epitaxial layer 104 to include the end of the polysilicon layer 106 on the plan view, and an n<SP>--</SP>-type impurity region 112 containing n-type impurities at a lower concentration than that of the n<SP>-</SP>-type silicon carbide epitaxial layer 104 is formed at least in a region on the surface of the n<SP>-</SP>-type silicon carbide epitaxial layer 104 surrounded by the p-type impurity region 108. COPYRIGHT: (C)2010,JPO&INPIT |