发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which enhances forward surge breakdown strength while maintaining a high reverse breakdown voltage. SOLUTION: A semiconductor device 1 includes an n<SP>+</SP>-type silicon carbide single crystal substrate 102, an n<SP>-</SP>-type silicon carbide epitaxial layer 104, a polysilicon layer 106, and a back electrode 110, wherein a p-type impurity region 108 is formed on the surface of the n<SP>-</SP>-type silicon carbide epitaxial layer 104 to include the end of the polysilicon layer 106 on the plan view, and an n<SP>--</SP>-type impurity region 112 containing n-type impurities at a lower concentration than that of the n<SP>-</SP>-type silicon carbide epitaxial layer 104 is formed at least in a region on the surface of the n<SP>-</SP>-type silicon carbide epitaxial layer 104 surrounded by the p-type impurity region 108. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009246048(A) 申请公布日期 2009.10.22
申请号 JP20080088800 申请日期 2008.03.28
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 TOMITA MASAAKI
分类号 H01L29/861 主分类号 H01L29/861
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