| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible copper clad laminate low in permittivity and a dielectric loss tangent in a high-frequency region while keeping adhesion reliability between copper foil and a polyimide layer without degrading properties possessed by polyimide such as heat resistance and dimensional stability, and excelling in a dielectric property. SOLUTION: In this flexible copper clad laminate having copper foil on one surface or both surfaces of the polyimide layer, a surface of the copper foil contacting the polyimide layer is not roughened; its surface roughness Rz is not larger than 1.0μm; the moisture absorptivity of the polyimide layer (i) in contact with the surface is not larger than 1.0%; and the concentration of an imide group is not larger than 33%. COPYRIGHT: (C)2010,JPO&INPIT |
